Vol. 11, Issue 2, 2014April 01, 2014 EDT
Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds
Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds
Mathew, Varughese, Sheila Chopin, Leo Higgins, and Yingrui Zhang. 2014. “Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds.” Journal of Microelectronics and Electronic Packaging 11 (2): 70–74. https://doi.org/10.4071/imaps.410.