Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds

Varughese Mathew; Sheila Chopin; Leo Higgins; Yingrui Zhang

doi:10.4071/imaps.410

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Mathew, Varughese, Sheila Chopin, Leo Higgins, and Yingrui Zhang. 2014. “Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds.” Journal of Microelectronics and Electronic Packaging 11 (2): 70–74. https://doi.org/10.4071/imaps.410.

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