ISSN 1551-4897
Vol. 11, Issue 2, 2014April 01, 2014 EDT
Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds
Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds
Articles in Vol. 11, Issue 2, 2014
Vol. 11, Issue 2, 2014
- Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle TestsGordon ElgerShri Vishnu KandaswamyRobert DerixJürgen Wilde
- Implementing Inductor Function with Vibrating Capacitor StructuresThomas F. MarinisJoseph W. Soucy
- Moisture and Hydrogen Release in Optoelectronic Hermetic PackagesM. AlbarghoutiN. El DahdahG. PerosevicS. JainJ.-M. PapillonS. Fernandez
- Heat Sink Induced Thermomechanical Joint Strain in QFN DevicesGerard McVickerVijay KhannaM. Sri-Jayantha
- Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside an LTCC Fluidic StructureJens Müller
- Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold CompoundsVarughese MathewSheila ChopinLeo HigginsYingrui Zhang
Mathew, Varughese, Sheila Chopin, Leo Higgins, and Yingrui Zhang. 2014. “Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds.” Journal of Microelectronics and Electronic Packaging 11 (2): 70–74. https://doi.org/10.4071/imaps.410.