Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders

Elviz George; Michael Osterman; Michael Pecht; Richard Coyle; Richard Parker; Elizabeth Benedetto

doi:10.4071/imaps.424

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George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. 2014. “Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders.” Journal of Microelectronics and Electronic Packaging 11 (4): 137–45. https://doi.org/10.4071/imaps.424.

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