Vol. 11, Issue 4, 2014October 01, 2014 EDT
Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders
Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders
George, Elviz, Michael Osterman, Michael Pecht, Richard Coyle, Richard Parker, and Elizabeth Benedetto. 2014. “Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders.” Journal of Microelectronics and Electronic Packaging 11 (4): 137–45. https://doi.org/10.4071/imaps.424.