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Vol. 11, Issue 4, 2014
October 01, 2014 EDT
High Temperature Laminate Characterization
David Shaddock
,
Liang Yin
,
High temperature electronics
high temperature packaging
reliability
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ccby-nc-nd-4.0
•
https://doi.org/10.4071/imaps.427
Journal of Microelectronics & Elect Pkg
Shaddock, David, and Liang Yin. 2014. “High Temperature Laminate Characterization.”
Journal of Microelectronics and Electronic Packaging
11 (4): 146–57.
https://doi.org/10.4071/imaps.427
.
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