ISSN 1551-4897
Articles in Vol. 11, Issue 4, 2014
Vol. 11, Issue 4, 2014
- Thermal Cycling Reliability of Alternative Low-Silver Tin-Based SoldersElviz GeorgeMichael OstermanMichael PechtRichard CoyleRichard ParkerElizabeth Benedetto
- High Temperature Laminate CharacterizationDavid ShaddockLiang Yin
- Uniqueness and Challenges of Sintered Silver as a Bonded Interface MaterialA. A. WereszczakZ. LiangM. K. FerberL. D. Marlino
- Stacked Ceramic Capacitors for High Temperatures (≥200°C)John BultitudeLonnie JonesJohn McConnellAbhijit Gurav
- Causality Verification Using Polynomial Periodic Continuations for Electrical InterconnectsLyudmyla L. BarannykHazem A. AboutalebAicha ElshabiniFred Barlow
- Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/in3 Power AssemblyWoochan KimJongwon ShinKhai D. T. Ngo
Shaddock, David, and Liang Yin. 2014. “High Temperature Laminate Characterization.” Journal of Microelectronics and Electronic Packaging 11 (4): 146–57. https://doi.org/10.4071/imaps.427.