Vol. 11, Issue 4, 2014October 01, 2014 EDT
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material
Wereszczak, A. A., Z. Liang, M. K. Ferber, and L. D. Marlino. 2014. “Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material.” Journal of Microelectronics and Electronic Packaging 11 (4): 158–65. https://doi.org/10.4071/imaps.429.