Vol. 11, Issue 4, 2014October 01, 2014 EDT
Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/in3 Power Assembly
Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/in3 Power Assembly
Kim, Woochan, Jongwon Shin, and Khai D. T. Ngo. 2014. “Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/In3 Power Assembly.” Journal of Microelectronics and Electronic Packaging 11 (4): 174–80. https://doi.org/10.4071/imaps.435.