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Vol. 11, Issue 3, 2014July 01, 2014 EDT

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

Robert N. Dean, Michael C. Hamilton, Michael E. Baginski,
Capacitance transducersflexible structuresinterdigital transducersmoisture transducersprinted circuits
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.415
Journal of Microelectronics & Elect Pkg
Dean, Robert N., Michael C. Hamilton, and Michael E. Baginski. 2014. “Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology.” Journal of Microelectronics and Electronic Packaging 11 (3): 122–27. https:/​/​doi.org/​10.4071/​imaps.415.
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