Advanced Thermal Management Solutions on PCBs for High Power Applications

Gregor Langer; Markus Leitgeb; Johann Nicolics; Michael Unger; Hans Hoschopf; Franz P. Wenzl

doi:10.4071/imaps.422

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Langer, Gregor, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf, and Franz P. Wenzl. 2014. “Advanced Thermal Management Solutions on PCBs for High Power Applications.” Journal of Microelectronics and Electronic Packaging 11 (3): 104–14. https://doi.org/10.4071/imaps.422.

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