Vol. 11, Issue 3, 2014July 01, 2014 EDT
Advanced Thermal Management Solutions on PCBs for High Power Applications
Advanced Thermal Management Solutions on PCBs for High Power Applications
Langer, Gregor, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf, and Franz P. Wenzl. 2014. “Advanced Thermal Management Solutions on PCBs for High Power Applications.” Journal of Microelectronics and Electronic Packaging 11 (3): 104–14. https://doi.org/10.4071/imaps.422.