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Vol. 11, Issue 3, 2014July 01, 2014 EDT

Advanced Thermal Management Solutions on PCBs for High Power Applications

Gregor Langer, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf, Franz P. Wenzl,
PCBthermal managementpower electronicslow thermal resistancecavities
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.422
Journal of Microelectronics & Elect Pkg
Langer, Gregor, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf, and Franz P. Wenzl. 2014. “Advanced Thermal Management Solutions on PCBs for High Power Applications.” Journal of Microelectronics and Electronic Packaging 11 (3): 104–14. https:/​/​doi.org/​10.4071/​imaps.422.
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