Vol. 11, Issue 3, 2014July 01, 2014 EDT
Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects
Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects
Cherman, Vladimir O., Nga P. Pham, John Slabbekoorn, Alessandro Faes, Benno Margesin, and Harrie A.C. Tilmans. 2014. “Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects.” Journal of Microelectronics and Electronic Packaging 11 (3): 87–93. https://doi.org/10.4071/imaps.418.