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Vol. 12, Issue 1, 2015January 01, 2015 EDT

Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth

Joseph M. Juarez, Polina Snugovsky, Eva Kosiba, Zohreh Bagheri, Subramaniam Suthakaran, Michael Robinson, Joel Heebink, Jeffrey Kennedy, Marianne Romansky,
ManufacturabilityReliability ScreeningLower Melting PointPb-Free AlloysBismuth
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.441
Journal of Microelectronics & Elect Pkg
Juarez, Joseph M., Polina Snugovsky, Eva Kosiba, Zohreh Bagheri, Subramaniam Suthakaran, Michael Robinson, Joel Heebink, Jeffrey Kennedy, and Marianne Romansky. 2015. “Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth.” Journal of Microelectronics and Electronic Packaging 12 (1): 1–28. https:/​/​doi.org/​10.4071/​imaps.441.
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