Vol. 12, Issue 1, 2015January 01, 2015 EDT
A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices
A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices
Smith, Lilla Safford, Gordon D. Hoople, Jim C. Cheng, and Albert P. Pisano. 2015. “A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices.” Journal of Microelectronics and Electronic Packaging 12 (1): 49–54. https://doi.org/10.4071/imaps.444.