Development of a Stress Compensation Layer for 3-D Assembly of Thin Pixel Modules

G. Pares; T. McMullen; S. Tomé; L. Vignoud; R. Bates; C. Buttar

doi:10.4071/imaps.454

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Pares, G., T. McMullen, S. Tomé, L. Vignoud, R. Bates, and C. Buttar. 2015. “Development of a Stress Compensation Layer for 3-D Assembly of Thin Pixel Modules.” Journal of Microelectronics and Electronic Packaging 12 (1): 29–36. https://doi.org/10.4071/imaps.454.

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