Vol. 12, Issue 1, 2015January 01, 2015 EDT
Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology
Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology
Schramm, Rene, Thomas Reitberger, and Joerg Franke. 2015. “Electrical and Mechanical Investigations on Copper Circuit Paths Coated on Fiber-Reinforced Plastics by Atmospheric Plasma Technology.” Journal of Microelectronics and Electronic Packaging 12 (1): 61–66. https://doi.org/10.4071/imaps.445.