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Vol. 12, Issue 2, 2015April 01, 2015 EDT

Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly

Sungbum Kang, I. Charles Ume,
Digital fringe projectionwarpagesegmentationprinted wiring board assemblysurface painting
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.449
Journal of Microelectronics & Elect Pkg
Kang, Sungbum, and I. Charles Ume. 2015. “Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly.” Journal of Microelectronics and Electronic Packaging 12 (2): 104–10. https:/​/​doi.org/​10.4071/​imaps.449.

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