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Vol. 12, Issue 1, 2015January 01, 2015 EDT

Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process

Chao Zeng, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu, Rong An,
Hot-cutting defectvariance analysisceramic packaging
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.433
Journal of Microelectronics & Elect Pkg
Zeng, Chao, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu, and Rong An. 2015. “Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process.” Journal of Microelectronics and Electronic Packaging 12 (1): 55–60. https:/​/​doi.org/​10.4071/​imaps.433.
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