Vol. 12, Issue 2, 2015April 01, 2015 EDT
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Kwon, Woon-Seong, Myongseob Kim, Jonathan Chang, Suresh Ramalingam, Liam Madden, Genie Tsai, Stephen Tseng, J.Y. Lai, Terren Lu, and Steve Chiu. 2015. “Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-Nm FPGA With Stacked Silicon Interconnect Technology.” Journal of Microelectronics and Electronic Packaging 12 (2): 67–71. https://doi.org/10.4071/imaps.453.