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Vol. 12, Issue 2, 2015April 01, 2015 EDT

The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu Films

Tobias Bernhard, Frank Brüning, Ralf Brüning, Tanu Sharma, Delilah Brown, Sebastian Zarwell, Craig Bishop,
Delamination failureelectroless Cuhydrogen evolutioninternal stress
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.458
Journal of Microelectronics & Elect Pkg
Bernhard, Tobias, Frank Brüning, Ralf Brüning, Tanu Sharma, Delilah Brown, Sebastian Zarwell, and Craig Bishop. 2015. “The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu Films.” Journal of Microelectronics and Electronic Packaging 12 (2): 86–91. https:/​/​doi.org/​10.4071/​imaps.458.
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