ISSN 1551-4897
Vol. 12, Issue 2, 2015April 01, 2015 EDT
Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process
Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process
Macurova, K., R. Bermejo, M. Pletz, R. Schöngrundner, T. Antretter, T. Krivec, M. Morianz, M. Brizoux, and A. Lecavelier. 2015. “Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process.” Journal of Microelectronics and Electronic Packaging 12 (2): 80–85. https://doi.org/10.4071/imaps.446.