Reliability Assessment of Flip-Chip Assembly of Al Bumps

Hidekazu Tanisawa; Kohei Hiyama; Takeshi Anzai; Hiroki Takahashi; Yoshinori Murakami; Shinji Sato; Kinuyo Watanabe; Fumiki Kato; Hiroshi Sato

doi:10.4071/imaps.459

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Tanisawa, Hidekazu, Kohei Hiyama, Takeshi Anzai, Hiroki Takahashi, Yoshinori Murakami, Shinji Sato, Kinuyo Watanabe, Fumiki Kato, and Hiroshi Sato. 2015. “Reliability Assessment of Flip-Chip Assembly of Al Bumps.” Journal of Microelectronics and Electronic Packaging 12 (2): 92–97. https://doi.org/10.4071/imaps.459.

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