Vol. 12, Issue 2, 2015April 01, 2015 EDT
Reliability Assessment of Flip-Chip Assembly of Al Bumps
Reliability Assessment of Flip-Chip Assembly of Al Bumps
Tanisawa, Hidekazu, Kohei Hiyama, Takeshi Anzai, Hiroki Takahashi, Yoshinori Murakami, Shinji Sato, Kinuyo Watanabe, Fumiki Kato, and Hiroshi Sato. 2015. “Reliability Assessment of Flip-Chip Assembly of Al Bumps.” Journal of Microelectronics and Electronic Packaging 12 (2): 92–97. https://doi.org/10.4071/imaps.459.