Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires

Araki, Noritoshi, Yasutomo Ichiyama, Ryo Oishi, Teruo Haibara, and Takashi Yamada. 2015. “Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding Wires.” Journal of Microelectronics and Electronic Packaging 12 (2): 98–103. https://doi.org/10.4071/imaps.460.