Challenges of Scalable 2.5D IC Assembly

Liang Wang; Charles G. Woychik; Guilian Gao; Grant Villavicencio; Scott McGrath; Hong Shen; Sitaram Arkalgud

doi:10.4071/imaps.455

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Wang, Liang, Charles G. Woychik, Guilian Gao, Grant Villavicencio, Scott McGrath, Hong Shen, and Sitaram Arkalgud. 2015. “Challenges of Scalable 2.5D IC Assembly.” Journal of Microelectronics and Electronic Packaging 12 (3): 123–28. https://doi.org/10.4071/imaps.455.

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