Challenges of Scalable 2.5D IC Assembly

Wang, Liang, Charles G. Woychik, Guilian Gao, Grant Villavicencio, Scott McGrath, Hong Shen, and Sitaram Arkalgud. 2015. “Challenges of Scalable 2.5D IC Assembly.” Journal of Microelectronics and Electronic Packaging 12 (3): 123–28. https:/​/​doi.org/​10.4071/​imaps.455.