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Vol. 12, Issue 3, 2015July 01, 2015 EDT

Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates

Madhav Datta,
Thermal conduction plateliquid cooling modulealuminum nitridemetal-ceramic bondinglaser diode coolingvoid-free bondingactive metal brazingMoMn metallization
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.473
Journal of Microelectronics & Elect Pkg
Datta, Madhav. 2015. “Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates.” Journal of Microelectronics and Electronic Packaging 12 (3): 146–52. https:/​/​doi.org/​10.4071/​imaps.473.
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