Vol. 12, Issue 3, 2015July 01, 2015 EDT
High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration
High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration
Jung, Do Hyun, Shalu Agarwal, Santosh Kumar, and Jae Pil Jung. 2015. “High Shear Speed Characteristics of Sub-100 Μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration.” Journal of Microelectronics and Electronic Packaging 12 (3): 161–69. https://doi.org/10.4071/imaps.416.