Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices

Anzai, Takeshi, Yoshinori Murakami, Shinji Sato, Hidekazu Tanisawa, Kohei Hiyama, Hiroki Takahashi, Fumiki Kato, and Hiroshi Sato. 2015. “Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices.” Journal of Microelectronics and Electronic Packaging 12 (3): 153–60. https://doi.org/10.4071/imaps.464.