Vol. 12, Issue 3, 2015July 01, 2015 EDT
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects
Jiang, Tengfei, Chenglin Wu, Jay Im, Rui Huang, and Paul S. Ho. 2015. “Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects.” Journal of Microelectronics and Electronic Packaging 12 (3): 118–22. https://doi.org/10.4071/imaps.456.