Vol. 12, Issue 3, 2015July 01, 2015 EDT
Design Considerations of High-Current Density Capacitors Micromachined for Si Interposers
Design Considerations of High-Current Density Capacitors Micromachined for Si Interposers
Beal, A. N., J. Tatarchuck, C. B. Stevens, T. A. Baginski, M. C. Hamilton, and R. N. Dean. 2015. “Design Considerations of High-Current Density Capacitors Micromachined for Si Interposers.” Journal of Microelectronics and Electronic Packaging 12 (3): 139–45. https://doi.org/10.4071/imaps.447.