Vol. 13, Issue 1, 2016January 01, 2016 EDT
Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
Raul Bermejo, Clemens Krautgasser, Marco Deluca, Martin Pletz, Peter Supancic, Franz Aldrian, Robert Danzer,
Bermejo, Raul, Clemens Krautgasser, Marco Deluca, Martin Pletz, Peter Supancic, Franz Aldrian, and Robert Danzer. 2016. “Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments.” Journal of Microelectronics and Electronic Packaging 13 (1): 17–22. https://doi.org/10.4071/imaps.491.