Vol. 12, Issue 4, 2015October 01, 2015 EDT
High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds
High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds
Mathew, Varughese, and Sheila Chopin. 2015. “High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds.” Journal of Microelectronics and Electronic Packaging 12 (4): 226–31. https://doi.org/10.4071/imaps.469.