Vol. 13, Issue 1, 2016January 01, 2016 EDT
Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power Packages
Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power Packages
Zhang, Hao, and Simon S. Ang. 2016. “Thermo-Mechanical Simulations for Single-Sided and Double-Sided Cooling Power Packages.” Journal of Microelectronics and Electronic Packaging 13 (1): 23–32. https://doi.org/10.4071/imaps.495.