Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C

A. Kelberer; S. Dreiner; K. Grella; D. Dittrich; H. Kappert; H. Vogt; U. Paschen

doi:10.4071/imaps.487

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Kelberer, A., S. Dreiner, K. Grella, D. Dittrich, H. Kappert, H. Vogt, and U. Paschen. 2016. “Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.” Journal of Microelectronics and Electronic Packaging 13 (1): 33–37. https://doi.org/10.4071/imaps.487.

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