ISSN 1551-4897
Vol. 13, Issue 1, 2016January 01, 2016 EDT
Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C
Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C
Articles in Vol. 13, Issue 1, 2016
Vol. 13, Issue 1, 2016
- Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different EnvironmentsRaul BermejoClemens KrautgasserMarco DelucaMartin PletzPeter SupancicFranz AldrianRobert Danzer
- Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power PackagesHao ZhangSimon S. Ang
- Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°CA. KelbererS. DreinerK. GrellaD. DittrichH. KappertH. VogtU. Paschen
- Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature ApplicationsPaul CroteauSayan SealRyan WitherellMichael GloverShashank KrishnamurthyAlan Mantooth
- SIP with TSV for Class 1 Medical DevicesYoungtak LeeDoug Link
Kelberer, A., S. Dreiner, K. Grella, D. Dittrich, H. Kappert, H. Vogt, and U. Paschen. 2016. “Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.” Journal of Microelectronics and Electronic Packaging 13 (1): 33–37. https://doi.org/10.4071/imaps.487.