ISSN 1551-4897
Articles in Vol. 13, Issue 1, 2016
Vol. 13, Issue 1, 2016
- Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different EnvironmentsRaul BermejoClemens KrautgasserMarco DelucaMartin PletzPeter SupancicFranz AldrianRobert Danzer
- Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power PackagesHao ZhangSimon S. Ang
- Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°CA. KelbererS. DreinerK. GrellaD. DittrichH. KappertH. VogtU. Paschen
- Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature ApplicationsPaul CroteauSayan SealRyan WitherellMichael GloverShashank KrishnamurthyAlan Mantooth
- SIP with TSV for Class 1 Medical DevicesYoungtak LeeDoug Link
Lee, Youngtak, and Doug Link. 2016. “SIP with TSV for Class 1 Medical Devices.” Journal of Microelectronics and Electronic Packaging 13 (1): 1–5. https://doi.org/10.4071/imaps.497.