Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications

Paul Croteau; Sayan Seal; Ryan Witherell; Michael Glover; Shashank Krishnamurthy; Alan Mantooth

doi:10.4071/imaps.492

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Croteau, Paul, Sayan Seal, Ryan Witherell, Michael Glover, Shashank Krishnamurthy, and Alan Mantooth. 2016. “Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications.” Journal of Microelectronics and Electronic Packaging 13 (1): 6–16. https://doi.org/10.4071/imaps.492.

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