Vol. 13, Issue 1, 2016January 01, 2016 EDT
Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications
Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications
Croteau, Paul, Sayan Seal, Ryan Witherell, Michael Glover, Shashank Krishnamurthy, and Alan Mantooth. 2016. “Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications.” Journal of Microelectronics and Electronic Packaging 13 (1): 6–16. https://doi.org/10.4071/imaps.492.