ISSN 1551-4897
Vol. 13, Issue 2, 2016April 01, 2016 EDT
Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates
Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates
Chou, Bruce, William Vis, Ryuta Furuya, Venky Sundaram, and Rao Tummala. 2016. “Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates.” Journal of Microelectronics and Electronic Packaging 13 (2): 51–57. https://doi.org/10.4071/imaps.502.