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Vol. 13, Issue 2, 2016April 01, 2016 EDT

Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates

Bruce Chou, William Vis, Ryuta Furuya, Venky Sundaram, Rao Tummala,
Finite difference time domain (FDTD) methodglass interposermoving-mask lithographyoptical waveguidesoptoelectronic packagingsingle-mode fiber
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.502
Journal of Microelectronics & Elect Pkg
Chou, Bruce, William Vis, Ryuta Furuya, Venky Sundaram, and Rao Tummala. 2016. “Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates.” Journal of Microelectronics and Electronic Packaging 13 (2): 51–57. https:/​/​doi.org/​10.4071/​imaps.502.
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