Vol. 13, Issue 2, 2016April 01, 2016 EDT
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications
Chen, Zheng, Yiying Yao, Wenli Zhang, Dushan Boroyevich, Khai Ngo, Paolo Mattavelli, and Rolando Burgos. 2016. “Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications.” Journal of Microelectronics and Electronic Packaging 13 (2): 39–50. https://doi.org/10.4071/imaps.503.