ISSN 1551-4897
Vol. 13, Issue 2, 2016April 01, 2016 EDT
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications
Articles in Vol. 13, Issue 2, 2016
Vol. 13, Issue 2, 2016
- Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency ApplicationsZheng ChenYiying YaoWenli ZhangDushan BoroyevichKhai NgoPaolo MattavelliRolando Burgos
- Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic SubstratesBruce ChouWilliam VisRyuta FuruyaVenky SundaramRao Tummala
- A New In-Line Laser-Based Acoustic Technique for Pillar Bump MetrologyTodd W. MurrayAndrew BakirDavid M. StobbeMichael J. KotelyanskiiRobin A. MairManjusha MehendaleXueping RuJonathan D. CohenMichelle T. SchulbergPriya MukundhanTimothy J. Kryman
- Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic StimulationCaroline K. BjuneThomas F. MarinisTirunelveli S. SriramJeanne M. BradyJames MoranPhilip D. ParksAlik S. WidgeDarin D. DoughertyEmad N. Eskandar
- Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D InterconnectionColin McDonoughDoug La TulipeDan PascualPaul TarielloJohn MucciMatt SmalleyAnh NguyenTuan VoCorbet JohnsonPhung NguyenJeremiah HebdingGerald LeakeMichele MorescErman TimurdoganVladimir StojanovićMichael R. WattsDouglas Coolbaugh
Chen, Zheng, Yiying Yao, Wenli Zhang, Dushan Boroyevich, Khai Ngo, Paolo Mattavelli, and Rolando Burgos. 2016. “Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications.” Journal of Microelectronics and Electronic Packaging 13 (2): 39–50. https://doi.org/10.4071/imaps.503.