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ISSN 1551-4897
General
Vol. 13, Issue 2, 2016April 01, 2016 EDT

A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology

Todd W. Murray, Andrew Bakir, David M. Stobbe, Michael J. Kotelyanskii, Robin A. Mair, Manjusha Mehendale, Xueping Ru, Jonathan D. Cohen, Michelle T. Schulberg, Priya Mukundhan, Timothy J. Kryman,
Copper pillar bump stacksacoustic metrologyadvanced packaging
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.501
Journal of Microelectronics & Elect Pkg
Murray, Todd W., Andrew Bakir, David M. Stobbe, Michael J. Kotelyanskii, Robin A. Mair, Manjusha Mehendale, Xueping Ru, et al. 2016. “A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology.” Journal of Microelectronics and Electronic Packaging 13 (2): 58–63. https:/​/​doi.org/​10.4071/​imaps.501.

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