Vol. 13, Issue 2, 2016April 01, 2016 EDT
A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology
A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology
Murray, Todd W., Andrew Bakir, David M. Stobbe, Michael J. Kotelyanskii, Robin A. Mair, Manjusha Mehendale, Xueping Ru, et al. 2016. “A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology.” Journal of Microelectronics and Electronic Packaging 13 (2): 58–63. https://doi.org/10.4071/imaps.501.