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Vol. 13, Issue 2, 2016April 01, 2016 EDT

Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection

Colin McDonough, Doug La Tulipe, Dan Pascual, Paul Tariello, John Mucci, Matt Smalley, Anh Nguyen, Tuan Vo, Corbet Johnson, Phung Nguyen, Jeremiah Hebding, Gerald Leake, Michele Moresc, Erman Timurdogan, Vladimir Stojanović, Michael R. Watts, Douglas Coolbaugh,
3-D-ICdirect oxide bondingheterogeneous integrationsilicon photonicsthrough-oxide via (TOV)
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.494
Journal of Microelectronics & Elect Pkg
McDonough, Colin, Doug La Tulipe, Dan Pascual, Paul Tariello, John Mucci, Matt Smalley, Anh Nguyen, et al. 2016. “Heterogeneous Integration of a 300-Mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection.” Journal of Microelectronics and Electronic Packaging 13 (2): 71–76. https:/​/​doi.org/​10.4071/​imaps.494.
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