Vol. 13, Issue 2, 2016April 01, 2016 EDT
Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection
Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection
McDonough, Colin, Doug La Tulipe, Dan Pascual, Paul Tariello, John Mucci, Matt Smalley, Anh Nguyen, et al. 2016. “Heterogeneous Integration of a 300-Mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection.” Journal of Microelectronics and Electronic Packaging 13 (2): 71–76. https://doi.org/10.4071/imaps.494.