Vol. 13, Issue 3, 2016July 01, 2016 EDT
Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-μm Bump Pitch
Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-μm Bump Pitch
Sawyer, Brett, Yuya Suzuki, Zihan Wu, Hao Lu, Venky Sundaram, Kadappan Panayappan, and Rao Tummala. 2016. “Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-Μm Bump Pitch.” Journal of Microelectronics and Electronic Packaging 13 (3): 128–35. https://doi.org/10.4071/imaps.504.