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Vol. 13, Issue 3, 2016July 01, 2016 EDT

Thick Film Process Characterization for Thin Film Metallized LTCC

M. A. Girardi, K. A. Peterson, P. T. Vianco,
LTCCthin filmthick film processshrinkagescreen print
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.512
Journal of Microelectronics & Elect Pkg
Girardi, M. A., K. A. Peterson, and P. T. Vianco. 2016. “Thick Film Process Characterization for Thin Film Metallized LTCC.” Journal of Microelectronics and Electronic Packaging 13 (3): 136–42. https:/​/​doi.org/​10.4071/​imaps.512.
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