Component Attachment with Pressureless Ag Sintering for 300°C Applications

Fang Yu; Jinzi Cui; Zhangming Zhou; R. Wayne Johnson; Michael C. Hamilton

doi:10.4071/imaps.524

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Yu, Fang, Jinzi Cui, Zhangming Zhou, R. Wayne Johnson, and Michael C. Hamilton. 2016. “Component Attachment with Pressureless Ag Sintering for 300°C Applications.” Journal of Microelectronics and Electronic Packaging 13 (4): 155–62. https://doi.org/10.4071/imaps.524.

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