ISSN 1551-4897
Vol. 13, Issue 4, 2016October 01, 2016 EDT
Toward Integrated Pressure Sensors for Temperatures up to 600°C
Toward Integrated Pressure Sensors for Temperatures up to 600°C
Articles in Vol. 13, Issue 4, 2016
Vol. 13, Issue 4, 2016
- Component Attachment with Pressureless Ag Sintering for 300°C ApplicationsFang YuJinzi CuiZhangming ZhouR. Wayne JohnsonMichael C. Hamilton
- Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface ApplicationJim HolmesA. Matthew FrancisIan GetreuMatthew BarlowAffan AbbasiH. Alan Mantooth
- Toward Integrated Pressure Sensors for Temperatures up to 600°CAyden MaralaniLevent BekerAlbert P. Pisano
- The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic InterposerSayan SealMichael D. GloverH. Alan Mantooth
- Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor ApplicationsRena GradmannThomas SeutheChristian VedderMarkus EbersteinUwe Partsch
- A PCB Environmental Sensor for Use in Monitoring Drought Conditions in EstuariesRobert N. DeanFrank T. Werner
Maralani, Ayden, Levent Beker, and Albert P. Pisano. 2016. “Toward Integrated Pressure Sensors for Temperatures up to 600°C.” Journal of Microelectronics and Electronic Packaging 13 (4): 163–68. https://doi.org/10.4071/imaps.522.