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Vol. 13, Issue 3, 2016July 01, 2016 EDT

Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power Modules

Hiroaki Tatsumi, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, Yoshihiro Kashiba,
bonding reliabilitymechanical propertiesnanocrystalline metalspower modulesilver nanoparticles
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.506
Journal of Microelectronics & Elect Pkg
Tatsumi, Hiroaki, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, and Yoshihiro Kashiba. 2016. “Impact of Metallurgical and Mechanical Properties of Sintered Silver Joints on Die-Attach Reliability of High-Temperature Power Modules.” Journal of Microelectronics and Electronic Packaging 13 (3): 121–27. https:/​/​doi.org/​10.4071/​imaps.506.
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