Vol. 13, Issue 4, 2016October 01, 2016 EDT
The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer
The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer
Seal, Sayan, Michael D. Glover, and H. Alan Mantooth. 2016. “The Design and Evaluation of an Integrated Wire Bond-Less Power Module Using a Low Temperature Co-Fired Ceramic Interposer.” Journal of Microelectronics and Electronic Packaging 13 (4): 169–75. https://doi.org/10.4071/imaps.514.