Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics

Liang-Yu Chen; Philip G. Neudeck; David J. Spry; Glenn M. Beheim; Gary W. Hunter

doi:10.4071/imaps.529

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Chen, Liang-Yu, Philip G. Neudeck, David J. Spry, Glenn M. Beheim, and Gary W. Hunter. 2017. “Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.” Journal of Microelectronics and Electronic Packaging 14 (1): 11–16. https://doi.org/10.4071/imaps.529.

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