Vol. 14, Issue 1, 2017January 01, 2017 EDT
Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect
Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect
Marsan-Loyer, C., D. Danovitch, and N. Boyer. 2017. “Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect.” Journal of Microelectronics and Electronic Packaging 14 (1): 32–38. https://doi.org/10.4071/imaps.348081.