Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics

Lérys Granado; Stefan Kempa; Stefanie Bremmert; Laurence J. Gregoriades; Frank Brüning; Eric Anglaret; Nicole Fréty

doi:10.4071/imaps.359903

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Granado, Lérys, Stefan Kempa, Stefanie Bremmert, Laurence J. Gregoriades, Frank Brüning, Eric Anglaret, and Nicole Fréty. 2017. “Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics.” Journal of Microelectronics and Electronic Packaging 14 (2): 45–50. https://doi.org/10.4071/imaps.359903.

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