Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing

Liu, Xiao, Qi Wu, Dongshun Bai, Trevor Stanley, Alvin Lee, Jay Su, and Baron Huang. 2017. “Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing.” Journal of Microelectronics and Electronic Packaging 14 (1): 39–43. https://doi.org/10.4071/imaps.349121.