Vol. 14, Issue 1, 2017January 01, 2017 EDT
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer
Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer
Kazuyuki Mitsukura, Masaya Toba, Kousuke Urashima, Yoshinori Ejiri, Kenichi Iwashita, Tomonori Minegishi, Kazuhiko Kurafuchi,
Mitsukura, Kazuyuki, Masaya Toba, Kousuke Urashima, Yoshinori Ejiri, Kenichi Iwashita, Tomonori Minegishi, and Kazuhiko Kurafuchi. 2017. “Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer.” Journal of Microelectronics and Electronic Packaging 14 (1): 26–31. https://doi.org/10.4071/imaps.348184.